Reports circulating online suggest that the upcoming PlayStation 5 model will offer improved cooling capabilities without the need for liquid metal cooling. Zuby_Tech, who recently shared videos of Sony’s Project Q handheld, revealed that the new hardware revision, known as the CFI-1300 series, will feature a 5nm APU. This smaller architecture is expected to generate less heat compared to the launch models’ 7nm APU and the CFI-1202 series’ 6nm APU, making liquid metal cooling unnecessary for the new console.
Rumour New PlayStation 5 Model:
• CFI-1300 Series
• 5nm APU
• No Liquid Metal#PlayStation5 #PS5
— @Zuby_Tech (@Zuby_Tech) July 25, 2023
While these rumors should be taken with caution, they align with what we already know about the potential hardware revision for the PlayStation 5. Sony has already improved efficiency with the CFI-1202 models, making it logical for them to take further steps to enhance cooling performance in the new model. This improved console is rumored to support a detachable disc drive and will likely have a similar size to the current models.
According to recent court documents, this enhanced PlayStation 5 model is expected to launch later this year at the same price as the Digital Edition. We will provide updates as more information becomes available, so stay tuned for the latest news.
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Basant Kasayap is an entertainment aficionado who delves into the glitz and glamour of the entertainment industry. From Hollywood to Bollywood to regional cinema, she offers readers an insider’s perspective on the world of movies, music, and pop culture.
